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FA Confidential
Big things often have small beginnings. As National Security Adviser to the President of the United ... more |
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Between The Dragons
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Between the Titans
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Guidebook for Managing Silicon Chip Reliability
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased a... more |
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Managing More-Than-Moore Integration Technology Development: A Story of an Advanced Technology Program in the Semiconductor Industry
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Managing More-Than-Moore Integration Technology Development: A Story of an Advanced Technology Program in the Semiconductor Industry
This book presents the real challenges and experiences of managing an advanced semiconductor technol... more |
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More-Than-Moore 2.5d and 3D Sip Integration
This book presents a realistic and a holistic review of the microelectronic and semiconductor techno... more |
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ADHD and Me
Meet eight-year-old Malory. Malory has a learning difference, but that doesn’t stop her from enjoyin... more |
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More-than-moore 2.5d and 3d Sip Integration
This book presents a realistic and a holistic review of the microelectronic and semiconductor techno... more |
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Three Dimensional System Integration: IC Stacking Process and Design
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system in... more |
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Guidebook for Managing Silicon Chip Reliability
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased a... more |
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ADHD and Me
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The Lonely Teddy Bear
Jink has spent the majority of his days sitting in his chair by the window in his Victorian home, pe... more |
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Stress Management for 3D ICs Using Through Silicon Vias: International Workshop on Stress Management for 3D ICs Using Through Si
Scientist and engineers as well as graduate students in the fields of This conference will be of int... more |
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You Don’t Have To Live Here
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Homecoming
new classic of war and loss, Natasha Radojcic s earthy prose and stirring compassion bring her characters to life to...... more |
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Homecoming: A Novel
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Three Dimensional System Integration: IC Stacking Process and Design
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