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    Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging

    Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging

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    Entering the post-Moore era, electronic packaging technology has played an increasingly important ro... more

    Hybrid Nanomaterials: Flexible Electronics Materials

    Hybrid Nanomaterials: Flexible Electronics Materials

    • 優惠價: 8525

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