博客來-作者-Jun So

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Electrical Design of Through Silicon Via

Electrical Design of Through Silicon Via

外文書 , Joungho Jun So/ Kim Lee Manho/ Pak , Ingram , 出版日期: 2014-05-20

優惠價: 6599 元

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3... more

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Electrical Design of Through Silicon Via

Electrical Design of Through Silicon Via

外文書 , Joungho Jun So Kim Lee Manho Pak , Ingram , 出版日期: 2016-09-27

優惠價: 6599 元

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3... more

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