博客來-作者-Ning-Cheng

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		Electronics Manufacturing: With Lead-Free, Haogen Free, and Conductive Adhesive Materials 外文書 , Christine P. W./ Lee John H. John H. (EDT)/ Wong Lau Ning-Cheng/ Ricky Lee S. W./ Lau , Ingram , 出版日期: 2002-09-13 優惠價: 7290 元 Publisher s Note: Products purchased from Third Party sellers are not guaranteed by the publisher fo... more	放入購物車下次再買
		Assembly and Reliability of Lead-Free Solder Joints 外文書 , John H. Lau Lee Ning-Cheng , Ingram , 出版日期: 2021-05-30 優惠價: 7799 元	可訂購時通知我
		Assembly and Reliability of Lead-Free Solder Joints 外文書 , John H. Lau Lee Ning-Cheng , Ingram , 出版日期: 2020-05-30 優惠價: 10799 元	可訂購時通知我
		Reflow Soldering Processes and Troubleshooting: Smt, Bga, Csp and Flip Chip Technologies 外文書 , Lee Ning-Cheng , Butterworth-Heinemann , 出版日期: 2001-12-28 優惠價: 4484 元	可訂購時通知我

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